| 摘要 |
PROBLEM TO BE SOLVED: To inhibit the deterioration of connection reliability without using a solder resist and simplifies the manufacturing processes in a printed wiring board which secures the stand-off height.SOLUTION: An insulation base material (20) forming a printed wiring board (11) comprises a thermoplastic resin. Wiring (21) is disposed on one surface (20a) of the insulation base material (20) and has a land (22) to which an electrode (12a) of an electronic component (12) is soldered. The insulation base material (20) has protruding parts (25) that are formed by heat press so as to protrude while being located adjacent to the wiring (21) and enclose the wiring (21) along a marginal part of the wiring (21). The electronic component (12) is mounted on a first protruding part (25a), located adjacent to the land (22) and positioned in an overlapping region (24) overlapping with the electronic component (12), from among the protruding parts (25). |
