METHOD AND APPARATUS FOR TREATING BONDING AND DEBONDING OF DEVICE WAFER AND CARRIER WAFER

摘要

The present invention relates to a wafer treatment method, and more particularly, to a method for treating a device wafer and a carrier wafer and to a debonding apparatus. According to the present invention, a method for treating a device wafer and a carrier wafer is provided, the method comprising: a temporary bonding step of temporarily bonding the device wafer and the carrier wafer to form a bonded wafer; a separation start point forming step of degrading the bonding force of at least a portion of the outermost periphery of the bonding layer formed between the device wafer and the carrier wafer so as to form a separation start point; and a separation step of debonding the device wafer and the carrier wafer starting from the separation start point.