摘要 |
The current invention is directed to embedded, wireless cloud-connector devices and systems that allow the embedded, wireless cloud-connector devices to be deployed in a variety of embedding devices, applications, and uses. The embedded, wireless, cloud-connector devices to which the current application is directed are implemented using a single integrated circuit, or set of integrated-circuit chips, and each interfaces to a device, product, or system in which the cloud-connector devices are embedded as subcomponents as well as to a communications-services provider. The cloud-connector devices provide data exchange between devices, products, and systems in which they are embedded and cloud providers that provide cloud-computing services, data-message routing, and wireless services through wireless carriers. Embedded, wireless cloud-connector devices, and the systems that interconnect and manage them, allow cloud-providers to extend the cloud-computing domain into many different types of low-cost and geographically dispersed markets and areas of use.
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