发明名称 |
Gold-tin etch using combination of halogen plasma and wet etch |
摘要 |
The present disclosure relates to an implantable medical device. The implantable medical device includes a component comprising a first substrate bonded to a second substrate. A method for forming the component includes removing a first portion of tin (Sn) from gold tin (AuSn) through a halogen plasma. A first portion of gold (Au) is exposed in response to removing the first portion of the Sn. The first portion of the Au through a wet etch. A second portion of the Sn is exposed in response to removing the first portion of Au.
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申请公布号 |
US8513120(B2) |
申请公布日期 |
2013.08.20 |
申请号 |
US201113097026 |
申请日期 |
2011.04.28 |
申请人 |
FLEISCHHAUER BRUCE C;MEDTRONIC, INC. |
发明人 |
FLEISCHHAUER BRUCE C |
分类号 |
H01L21/306;H01L21/28 |
主分类号 |
H01L21/306 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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