发明名称 SOLID-STATE IMAGING DEVICE
摘要 PROBLEM TO BE SOLVED: To prevent characteristic deterioration of a photodiode.SOLUTION: In a solid-state imaging device, a photodiode 1 includes a first semiconductor layer 10 of a first conductivity type buried in a groove RX in a semiconductor substrate 150, and a first impurity region 151 of the first conductivity type provided in the semiconductor substrate 150 along the first semiconductor layer 10.
申请公布号 JP2013162077(A) 申请公布日期 2013.08.19
申请号 JP20120025093 申请日期 2012.02.08
申请人 TOSHIBA CORP 发明人 OISHI SHU
分类号 H01L27/146 主分类号 H01L27/146
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