发明名称 ELECTROPLATING METHOD AND ELECTROPLATING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide an electroplating method and an electroplating apparatus capable of reducing bad smell generated when executing the electroplating while blowing gas in plating liquid, and to considerably reduce energy consumption necessary for keeping the working environment.SOLUTION: In an electroplating method for performing the plating treatment while blowing gas containing oxygen such as air in plating liquid 10, the gas containing oxygen to be blown into the plating liquid 10 does not contain gaseous carbon dioxide.
申请公布号 JP2013159820(A) 申请公布日期 2013.08.19
申请号 JP20120022426 申请日期 2012.02.03
申请人 NIPPON MEKTRON LTD 发明人 ENDO SEIJI;MOKUTANI NORIO;HIRAIWA TOSHIKI
分类号 C25D21/18;C25D3/38 主分类号 C25D21/18
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