| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board which has excellent reflow resistance and aging resistance, and is high in mounting reliability, and a method for manufacturing the same.SOLUTION: The wiring board 1 includes: an electrode 12 composed of Cu or a Cu alloy; and a plating film 14 formed on the electrode 12, and the plating film 14 is composed of a laminate film in which an electroless nickel plating layer 18, an electroless palladium plating layer 20, and an electroless gold plating layer 22 are formed in order from the electrode 12 side. The electroless nickel plating layer 18 is formed by co-deposition of Ni, P, Bi and S, in which the content of P is 5 mass% or more but less than 10 mass%, the content of Bi is 1-1,000 ppm by mass, and the content of S is 1-2,000 ppm by mass, and the mass ratio (S/Bi) of the content of S to the content of Bi is more than 1.0. |
