发明名称 Patterning process and resist composition
摘要 The process forms a pattern by applying a resist composition onto a substrate to form a resist film, baking, exposure, post-exposure baking, and development. The resist composition comprises a polymer comprising recurring units having an acid labile group and substantially insoluble in alkaline developer, a PAG, a PBG capable of generating an amino group, a quencher for neutralizing the acid from PAG for inactivation, and an organic solvent. A total amount of amino groups from the quencher and PBG is greater than an amount of acid from PAG. An unexposed region and an over-exposed region are not dissolved in developer whereas only an intermediate exposure dose region is dissolved in developer. Resolution is doubled by splitting a single line into two through single exposure and development.
申请公布号 US8507175(B2) 申请公布日期 2013.08.13
申请号 US20100905426 申请日期 2010.10.15
申请人 HATAKEYAMA JUN;OHASHI MASAKI;OHSAWA YOUICHI;KATAYAMA KAZUHIRO;SHIN-ETSU CHEMICAL CO., LTD. 发明人 HATAKEYAMA JUN;OHASHI MASAKI;OHSAWA YOUICHI;KATAYAMA KAZUHIRO
分类号 G03F7/00;G03F7/004;G03F7/028;G03F7/20 主分类号 G03F7/00
代理机构 代理人
主权项
地址