EUTECTIC DIE BONDING APPARATUS, SYSTEM AND BONDING EUTECTIC PERFORM METHOD USING THEREOF

摘要

PURPOSE: A eutectic die bonding apparatus, a system, and a eutectic method using the same are provided to prevent components from being damaged due to excessive heat by rapidly supplying necessary heat with a high frequency induction heating method. CONSTITUTION: A eutectic die collet (10) is combined with a high frequency oscillator. A first insulation layer (20) is formed on the outer surface of the eutectic die collet. An induction coil (40) is wound around the first insulation layer. A second insulation layer (30) is formed around the first insulation layer which the induction coil is wound around. A thermocouple sensor (50) is formed around the second insulation layer in the same length direction as the eutectic die collet. [Reference numerals] (110) Control unit; (120) High frequency oscillator