| 摘要 |
PROBLEM TO BE SOLVED: To provide a light emitter which makes voids less likely to occur in a joining layer even if a substrate and a light emitting element are pressurized when those components are joined and achieves excellent connection reliability between the substrate and the light emitting element, and to provide a manufacturing method of the light emitter.SOLUTION: A light emitter 10 includes a light emitting element 11 and a substrate 12 supporting the light emitting element 11, and a joining layer 13, formed by a burned substance composed of Ag generated by reducing silver oxide and Ag particles, is formed between the light emitting element 11 and the substrate 12. The joining layer 13 is formed as the burned substance of an Ag containing silver oxide paste containing silver oxide particles, a reductant agent, the Ag particles, and a solvent. |
