| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic component having whisker inhibition ability enhanced dramatically, with high productivity.SOLUTION: Ni plating films 22a, 22b are formed on the surface of external electrodes 20a, 20b of an electronic component element 12 of a multilayer ceramic capacitor 10 as an electronic component, and Sn plating films 24a, 24b having an Sn polycrystalline structure are formed on the surface of the Ni plating films 22a, 22b. The Ni plating films 22a, 22b are formed so that the particle size of the Ni plating film is 0.1 μm or less, in 95% or more of the region of a part coming into contact with the Sn plating film. Flake-like Sn-Ni alloy particles are formed by heat treatment in the grain boundary and Sn grains in the Sn plating films 24a, 24b. |
