FILM FORMING DEVICE, AND FILM FORMING METHOD

摘要

A film forming device (10) is provided with: a vapor deposition head (16c) for spraying vapor deposition gas containing the vapor of a vapor deposition material; a treatment container (11) for defining a treatment chamber (12) housing the vapor deposition head (16c) and a substrate (S) facing the vapor deposition head; a vapor generation unit (31) for generating the vapor of a vapor deposition material (X); carrier gas transportation pipes (L12, L13) capable of being heated and for connecting the vapor generation unit (30) with the vapor deposition head (16c); a position detection sensor (28) for acquiring the relative positions of the substrate (S) and the vapor deposition head (16c); and a first MFC (41) for controlling the flow rate of the carrier gas supplied to the vapor generation unit (30) in accordance with the relative positions. DRAWING: