| 摘要 |
PROBLEM TO BE SOLVED: To provide a novel wafer processing apparatus including a moving mechanism capable of moving a plurality of wafers simultaneously.SOLUTION: A wafer processing apparatus 1 includes a pedestal part 15 capable of moving up and down and rotating on a center axis C1, a first operation part 16 having a first hand part 16a and a first arm part 16b, a second operation part 17 having a second hand part 17a and a second arm part 17b, and a processing chamber 11. The first and second hand parts 16a and 17a extend radially from the side of the center axis C1 respectively. The first and second arm parts 16b and 17b move back the first or second hand part 16a or 17a radially. The second hand part 17a is positioned at a distance L above the first hand part 16a. A wafer installation surface of a second installation part 22 is provided at the distance L above a wafer installation surface of the first installation part 21. |
