| 摘要 |
PURPOSE: A substrate bonding device is provided to evenly place a substrate when the substrate is mounted, thereby preventing damage of the substrate. CONSTITUTION: A diaphragm of an upper table is expanded to separate an upper substrate from an upper bonding chuck. A lower table includes a lift pin(162) to mount or separate a lower substrate on or from a lower bonding chuck. A plurality of suction grooves(228) evenly suction the lower substrate which is mounted on the lower table. A minute stepped portion is formed on the lower table to discharge air which is generated between the lower substrate and the lower table. |
