发明名称 |
LED and method for manufacturing the same |
摘要 |
An LED includes a base, a pair of leads fixed on the base, a housing fixed on the leads, a chip mounted on one lead and an encapsulant sealing the chip. The housing defines a cavity in a central area thereof and a chamber adjacent to a circumferential periphery thereof. Top faces of the leads are exposed in the chamber. A blocking wall is formed in the chamber to contact the exposed top faces of the leads. A bonding force between the blocking wall and the leads is larger than that between the leads and the housing. A method for manufacturing the LED is also disclosed. |
申请公布号 |
US8492180(B2) |
申请公布日期 |
2013.07.23 |
申请号 |
US201113330688 |
申请日期 |
2011.12.20 |
申请人 |
LIN HSIN-CHIANG;CHEN PIN-CHUAN;ADVANCED OPTOELECTRONIC TECHNOLOGY, INC. |
发明人 |
LIN HSIN-CHIANG;CHEN PIN-CHUAN |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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