INSULATION MATERIAL FOR ELECTRONIC DEVICE 전자소자용 절연재

摘要

The present invention relates to an insulation material for an electronic device, which can prevent damage to the electronic device due to a hardening process of the insulation material at a high temperature while exhibiting superior physical properties and reliability. The insulation material for the electronic device comprises: a soluble polyamide resin containing a specific repeat unit; and a residual catalyst comprising a catalyst having a low boiling point which falls between 130 to 180°C, and exhibits at least 70% imidization after hardening at a temperature of lower than or equal to 250°C.