| 发明名称 |
ADHESIVE COMPOSITION, ADHESIVE TAPE, AND METHOD FOR PROCESSING WAFER |
| 摘要 |
<p>The purpose of the present invention is to provide: an adhesive composition having excellent heat resistance, which has high adhesive power and can still be easily released; an adhesive tape which uses the adhesive composition; and a method for processing a wafer, wherein the adhesive tape is used. The present invention is an adhesive composition which contains a photocurable adhesive component, a photopolymerization initiator, and a gas generator that generates a gas when irradiated with light. The gas generator is dispersed in the adhesive composition with a dispersion diameter of 0.05-37 mum.</p> |
| 申请公布号 |
WO2013105582(A1) |
申请公布日期 |
2013.07.18 |
| 申请号 |
WO2013JP50237 |
申请日期 |
2013.01.09 |
| 申请人 |
SEKISUI CHEMICAL CO., LTD. |
发明人 |
TONEGAWA TORU;ASAO TAKAHIRO |
| 分类号 |
C09J201/00;C09J7/02;C09J11/06;C09J133/06 |
主分类号 |
C09J201/00 |
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