发明名称
摘要 PROBLEM TO BE SOLVED: To achieve more certain division of a workpiece configured by forming a dissimilar material layer on a substrate. SOLUTION: A machining method for forming a division starting point on the workpiece includes: a placing step of placing the workpiece on a stage; a preliminary machining step of exposing a base substrate at the position of a first preset machining line by irradiating with a first laser beam from a first light source along the first preset machining line; and a regular machining step of generating cleavage or parting of the base substrate between the regions to be irradiated by irradiating the exposed portion of the base substrate with a second laser beam which is an ultrashort pulsed light having a pulse width of a picosecond order from a second light source in such a manner that an irradiation region for each unit pulsed light is formed discretely. The preliminary and regular machining processes are performed while moving the stage to a first direction. COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP5240267(B2) 申请公布日期 2013.07.17
申请号 JP20100221294 申请日期 2010.09.30
申请人 发明人
分类号 B23K26/00;B23K26/04;B23K26/38;B23K26/40;B28D5/00;H01L21/301 主分类号 B23K26/00
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