MANUFACTURING METHOD OF DOUBLE-SIDED PRINTED CIRCUIT BOARD

摘要

PURPOSE: A manufacturing method of double side printed circuit board is provide to implement an operation of circuit pattern which is formed in an upper side and lower side of an insulating layer, thereby lowering a failure rate. CONSTITUTION: A conductivity first circuit pattern (20) is formed in an upper side of an insulating layer (10). A conductivity second circuit pattern (30) is formed in a lower side of the insulating layer. A hole (40) which passes through the insulating layer in an upper and lower direction is formed. A conductive material (50) is formed in the inner side of the hole. A plating layer (70) is formed on the conductive material. [Reference numerals] (AA) First circuit pattern printing process; (BB) Second circuit pattern printing process; (CC) Protection film laminate process; (DD) Whole hole processing; (EE) Whole hole printing processing; (FF) Protection film deliminate and heat treat processing; (GG) Plating processing