| 摘要 |
An electronic device package box includes a base having a pin-protruding face and a first mounting face for mounting a plurality of electronic components thereto, a plurality of first pins mounted to the base for electrical connection with the electronic components and each including a first connection section protruding from the pin-protruding face, a cover connected to and cooperating with the base to define a packaging space, and a plurality of second pins mounted to the cover for electrical connection with a plurality of electronic components. The cover has a second mounting face for mounting the electronic components thereto. Each second pin includes a second connection section protruding from one of the base and the cover.
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