| 摘要 |
There are provided a resin composition for printed wiring boards that has a low coefficient of thermal expansion in a plane direction, has excellent heat resistance and drilling workability, and, at the same time, can retain a high level of flame retardance, a prepreg prepared using the resin composition, and a laminated sheet and a metal foil-laminated sheet prepared using the prepreg. The resin composition comprises (A) an inorganic filler that is a mixture composed of a hydromagnesite represented by formula (1):
€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒxMgCO 3 ·yMg(OH) 2 ·zH 2 O€ƒ€ƒ€ƒ€ƒ€ƒ(1)
wherein x : y : z is 4 : 1 : 4, 4 : 1 : 5, 4 : 1 : 6, 4 : 1 : 7, 3 : 1 : 3, or 3 : 1 : 4
and huntite; (B) an epoxy resin; and (C) a curing agent. |
