发明名称 LIGHT EMITTING DIODE PACKAGE, AND METHOD FOR MANUFACTURING THE LIGHT EMITTING DEVICE PACKAGE
摘要 PURPOSE: A light emitting device package and a method for manufacturing the light emitting device package are provided to improve the brightness of a backlight unit by increasing the reflection rate to a light guide plate. CONSTITUTION: A body part (30) includes a metal having a first surface. The first surface includes a mounting surface. An insulating layer (70) surrounds a part of the body part. A line layer (10) is arranged on the insulating layer. The line layer and the insulating layer have the same pattern on the first surface.
申请公布号 KR20130074295(A) 申请公布日期 2013.07.04
申请号 KR20110142291 申请日期 2011.12.26
申请人 LUMENS CO., LTD. 发明人 CHO, HYUN RYONG
分类号 H01L33/48 主分类号 H01L33/48
代理机构 代理人
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