发明名称 Resistive Memory and Methods for Forming the Same
摘要 A device includes an active region formed of a semiconductor material, a gate dielectric at a surface of the active region, and a gate electrode over the gate dielectric. A first source/drain region and a second source/drain region are on opposite sides of the gate electrode. A Contact Etch Stop Layer (CESL) is over the first and the second source/drain regions. An Inter-Layer Dielectric (ILD) includes a top surface substantially level with a top surface of the gate electrode. A first contact plug is over and electrically connected to the first source/drain region. A second contact plug is over and aligned to the second source/drain region. The second contact plug and the second source/drain region are spaced apart from each other by a portion of the first CESL to form a capacitor.
申请公布号 US2013161707(A1) 申请公布日期 2013.06.27
申请号 US201113335569 申请日期 2011.12.22
申请人 HUANG CHIA-EN;LIN WUN-JIE;HU LING-CHANG;YANG HSIAO-LAN;CHIU CHIH-CHIEH;KAO WEI-SHUO;CHENG HONG-CHEN;WU FU-AN;YANG JUNG-PING;LEE CHENG HUNG;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 发明人 HUANG CHIA-EN;LIN WUN-JIE;HU LING-CHANG;YANG HSIAO-LAN;CHIU CHIH-CHIEH;KAO WEI-SHUO;CHENG HONG-CHEN;WU FU-AN;YANG JUNG-PING;LEE CHENG HUNG
分类号 H01L29/78;H01L21/336 主分类号 H01L29/78
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