PURPOSE: A semiconductor package is provided to reduce the generation of heat by soldering a plurality of semiconductor devices on one substrate using an insulating substrate. CONSTITUTION: A first heat radiation part(110) includes a first rotor. The first rotor is inserted into a first pipe. A second heat radiation part(120) includes a second rotor. The second rotor is inserted into a second pipe. A housing(140) fixes a semiconductor module and the first and second heat radiation parts.
