WIRING BOARD, METHOD OF MANUFACTURING THE SAME, AND AQUEOUS SOLUTION FOR SILVER ION DIFFUSION SUPPRESSION LAYER FORMATION

摘要

PROBLEM TO BE SOLVED: To provide a wiring board in which silver ion migration between metal wiring made of silver or silver alloy is suppressed and insulation reliability between the metal wiring is more excellent, and also to provide a method of manufacturing the same.

SOLUTION: A method of manufacturing a wiring board includes: a contact step in which an aqueous solution for silver ion diffusion suppression layer formation containing a compound represented by formula (1) and/or a compound represented by formula (2) and water is brought into contact with an insulation substrate with metal wiring having the insulation substrate and metal wiring made of silver or silver alloy disposed on the insulation substrate; and a cleaning step in which the insulation substrate with the metal wiring is cleaned using a solvent and a silver diffusion suppression layer covering the metal wiring in this order.

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