发明名称 HEAT SINK ASSEMBLY
摘要 A heat sink assembly includes a heat sink, two first fixing structures, and two second fixing structures. The heat sink includes a base. The base includes two opposite sidewalls each forming a fixing portion. When the heat sink is mounted to a first motherboard, the first fixing structures are respectively and detachably connected to the fixing portions of the heat sink, and fix the heat sink to the first motherboard. When the heat sink is mounted to a second motherboard, the second fixing structures are detachably connected to fixing portions of the heat sink, and fix the heat sink to the second motherboard.
申请公布号 US2013155623(A1) 申请公布日期 2013.06.20
申请号 US201213455145 申请日期 2012.04.25
申请人 MA XIAO-FENG;LIU LEI;HON HAI PRECISION INDUSTRY CO., LTD.;HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD. 发明人 MA XIAO-FENG;LIU LEI
分类号 H05K7/20 主分类号 H05K7/20
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