| 摘要 |
A molded part that has a relatively small thickness so that it can be readily employed in portable electronic devices is provided. The molded part is formed from a thermoplastic composition that contains a polyarylene sulfide and an aromatic amide oligomer. Due to the improved crystallization rate, the thermoplastic composition can be molded at lower temperatures to still achieve the same degree of crystallization. In addition to minimizing the energy requirements of the molding operating, the use of lower temperatures can also decrease the production of "flash" normally associated with high temperature molding operations. The composition may also possess good viscosity properties that allow it to be readily molded into parts of a variety of different shapes and sizes.
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