发明名称 METHOD AND APPARATUS FOR POURING BONDING FILLER IN A PERFORATION EXPANSION PORTION FOR ENHANCING THE SUPPORT FORCE OF A PILE OR TENSILE MEMBER
摘要 <p>The present invention relates to a method for pouring a bonding filler after forming a hole portion at a perforation hole which is bored in a depth direction of the ground in order work on an expansion portion at which a pile or a tensile member for construction works is erected. A balloon containing the curable bonding filler is arranged at a leading bottom portion of the pile or tensile member, and the pile or tensile member is lowered down to the bottom of the hole portion. Then, the pile or tensile member is pressed such that the balloon disposed at the bottom portion is compressed in the vertical direction, and expands in the radial direction up to an outline of the hole portion. The bonding filler in the expanded balloon is filled in the hole portion while the dimensions of the hole portion are maintained.</p>
申请公布号 WO2013089466(A1) 申请公布日期 2013.06.20
申请号 WO2012KR10873 申请日期 2012.12.14
申请人 SAMIL ENGINEERING&CONSTRUCTION CO., LTD 发明人 YIM, SEONG-DAE
分类号 E02D5/54;E02D5/62 主分类号 E02D5/54
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