| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a partial plating method in which partial plating can be performed which controls cyanogen burn, while reducing time required for processing. <P>SOLUTION: In the partial plating method, a part of copper plating performed over an entire hollow machine element part 1 is detached. The copper plating is performed over the entire machine element part 1, and inside the machine element part 1, at least a part of the surface of a plating layer in the boundary division 80 between the portion 31 from which the copper plating is to be detached and the portion 30 from which the copper plating is not to be detached is smoothed. Then, by immersing the portion 31 from which the copper plating is to be detached of the machine element part 1 in an aqueous solution of a cyanogen compound, the cooper plating performed on the portion 31 to be detached is detached. <P>COPYRIGHT: (C)2013,JPO&INPIT |
