REMOVER COMPOSITION OF ADHESIVE FOR INGOT SLICING PROCESS

摘要

PURPOSE: A remover composition of an adhesive for ingot slicing process is provided to effectively detach wafer from a beam by quickly swelling a polymer compound. CONSTITUTION: A remover composition of an adhesive for ingot slicing process comprises a dioxolane compound represented by chemical formula 1; a mixture of one or more compounds selected from organic and inorganic acids; and water. In chemical formula 1, each of R1 and R2 is independently hydrogen or C1-4 hydrocarbon group, and n is an integer from 0-4. The amount of the dioxolane compound is 1-50 wt% and the amount of the mixture is 0.1-50 wt%, based on the total weight of the remover composition.