DENSE-PITCH SMALL-PAD COPPER WIRE BONDED DOUBLE IC CHIP STACK PACKAGING PIECE AND PREPARATION METHOD THEREFOR

摘要

A dense-pitch small-pad copper wire bonded double IC chip stack packaging piece comprises a plastic packaging body. The plastic packaging body is provided with a lead wire framework carrier and a framework lead wire inner pin therein. A first IC chip is fixedly connected to the lead wire framework carrier, and a second IC chip is stacked on the first IC chip. Upper surfaces of the first IC chip and the second IC chip are respectively provided with a plurality of pads. The plurality of pads forms two columns of pad groups provided in parallel, respectively being a first pad group and a second pad group. A golden ball is implanted in each pad, and each golden ball is connected to a first copper bonded ball. A third copper bonding line is formed between the second IC chip and the first IC chip through looping and arcing on corresponding golden balls. Preparation processes of the present invention comprise thinning, slicing, chip mounting, press welding, plastic packaging, post-solidifying, trimming, electroplating, printing, shaping, separating, and packing. The packaging piece and the preparation method of the present invention avoid the hidden trouble of an open circuit of a plastic packaging punching line caused by the crater on the pad, the short circuit of adjacent welding points, and the easy damage of a previous line.