发明名称 HOUSING FOR MODULE AND BATTERY PACK
摘要 <P>PROBLEM TO BE SOLVED: To provide a light-weight housing for a module which achieves high rigidity, has good cooling characteristics, and houses multiple film coated electric devices. <P>SOLUTION: A housing for a module 20 of this invention includes: a first side surface part 31 erected from a bottom surface 32; a holding surface 42 which connects with the first side surface part 31 and holds a module 14 formed by laminating multiple cases for film coated electric devices; a second side surface part 43 erected from the holding surface 42; and a bent part 41 formed at the second side surface part 43 and having a shape fitting in a groove 12 formed in the cases for the film coated electric devices. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013118195(A) 申请公布日期 2013.06.13
申请号 JP20130053514 申请日期 2013.03.15
申请人 NEC CORP;FUJI HEAVY IND LTD 发明人 HOSOYA TOSHIZO
分类号 H01M2/10 主分类号 H01M2/10
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