发明名称 HEAT RADIANT STRUCTURE FOR LED
摘要 PURPOSE: A heat radiation structure of an LED is provided to maximize heat transmission efficiency by fixing an insulation heat radiation pad to each lead frame. CONSTITUTION: A lead frame(20) supplies power to an LED device(10). A molding unit(40) molds the upper side of each lead frame with transparent materials. An insulation heat radiation pad(50) is fitted to each lead frame. The heat radiation pad is made of flexible resin materials.
申请公布号 KR101273321(B1) 申请公布日期 2013.06.11
申请号 KR20100090855 申请日期 2010.09.16
申请人 发明人
分类号 F21V17/00;F21V29/00;F21Y101/02 主分类号 F21V17/00
代理机构 代理人
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