APPARATUS FOR FORMING SOLDER BUMP, AND FACILITY WITH THE SAME

摘要

PURPOSE: A solder bump forming apparatus and a soldering facility including the same are provided to improve soldering process efficiency by consecutively processing a flux treatment process and a solder treatment process. CONSTITUTION: A flux discharger(110) discharges a flux about a substrate. The flux discharger includes a first temperature controller. The first temperature controller heats the flux at a predetermined activation temperature. A solder discharger(120) discharges a solder on the substrate on which the flux is coated. A driver(140) drives the flux discharger and the solder discharger.