| 摘要 |
A piezoelectric device 100 is provided with an element-mounting member 110, a piezoelectric element 120 mounted on the element-mounting member 110, a metal pattern 118 which is formed at the surface of the element-mounting member 110 and includes an element-mounting region 118a and a lead region 118b, and an integrated circuit element 130 which is electrically connected to the element-mounting region 118a of the metal pattern 118 by solder bump 132, wherein the metal pattern 118 has a projecting part 119 which is provided between the element-mounting region 118a and the lead region 118b, and at least the surface portion of the projecting part 119 is made of a metal oxide.
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