发明名称 Method of manufacturing solid state imaging device, solid state imaging device, and camera using solid state imaging device
摘要 A method of manufacturing a solid state imaging device having a photo-electric conversion portion array and a transfer electrode array, these arrays being provided in parallel to each other, upper surfaces and side wall surfaces of the transfer electrode array being covered with a light-shielding layer, and a transparent layer showing an oxidizing property at the time of film formation, the transparent layer being formed on the photo-electric conversion parts and the light-shielding layer.
申请公布号 US8455291(B2) 申请公布日期 2013.06.04
申请号 US201113017876 申请日期 2011.01.31
申请人 TAKEDA TAKESHI;DOFUKU TADAYUKI;TAKEO KENJI;SONY CORPORATION 发明人 TAKEDA TAKESHI;DOFUKU TADAYUKI;TAKEO KENJI
分类号 H01L27/146;H01L27/148 主分类号 H01L27/146
代理机构 代理人
主权项
地址