发明名称 PLASMA PROCESSING APPARATUS
摘要 PURPOSE: A plasma processing apparatus is provided to generate plasma with a uniform energy distribution in a chamber by uniformizing the length of an RF power path which reaches the front of a bottom electrode. CONSTITUTION: A chamber(110) has a processing space to generate plasma. A shower head(141) is installed on the upper inner side of the chamber to uniformly spray a processing gas to the chamber. A bottom electrode(150) is installed in the chamber and supports a substrate. A power source unit(142) is connected to the bottom electrode and applies RF power. An RF path changing unit(160) controls an RF power path along the surface of the bottom electrode.
申请公布号 KR20130057368(A) 申请公布日期 2013.05.31
申请号 KR20110123229 申请日期 2011.11.23
申请人 LIGADP CO., LTD. 发明人 SON, HYOUNG KYU
分类号 H01L21/3065;H01L21/205 主分类号 H01L21/3065
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