| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a flexible printed board which deals with high density mounting while inhibiting warpage. <P>SOLUTION: A flexible printed board 13 has a base film 25. The flexible printed board 13 has a first conductor layer 26 on one main surface 25a of the base film 25. The flexible printed board 13 has a second conductor layer 28 on the other main surface 25b of the base film 25. The flexible printed board 13 has a first protection layer 27 covering the first conductor layer 26. The flexible printed board 13 has a second protection layer 29 covering the second conductor layer 28. At least a part of at least one of the first protection layer 27 and the second protection layer 29 is formed by a photosensitivity resist, and thermal expansion coefficients of the first protection layer 27 and the second protection layer 29 are equal to each other on the whole. <P>COPYRIGHT: (C)2013,JPO&INPIT |
