Package for high frequency circuits

摘要

The present invention relates to suppression of spurious resonant cavity wave modes which can occur in a range of orientations within integrated circuit packaging for high frequency circuits (operating above 10 GHz), for example monolithic microwave integrated circuits (MMICs). The package includes a plurality of discrete elongated conductive regions that project into the cavity and are configured to uniformly absorb all resonant wave modes. The elongated projecting members may have circular cross sections, and may form cones or truncated cones which can be arranged in regular or irregular arrays. The surfaces may be smooth or irregular. The projecting members may be perpendicular to the cavity side from which they project, or at oblique angles.