发明名称 |
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF |
摘要 |
<P>PROBLEM TO BE SOLVED: To reduce hydrogen concentration and oxygen vacancies in an oxide semiconductor film, and to improve reliability of a semiconductor device which includes a transistor using an oxide semiconductor film. <P>SOLUTION: A semiconductor device includes: a base insulating film; an oxide semiconductor film formed over the base insulating film; a gate insulating film formed over the oxide semiconductor film; and a gate electrode overlapping with the oxide semiconductor film with the gate insulating film provided therebetween. The base insulating film shows a signal at a g value of 2.01 by electron spin resonance. The oxide semiconductor film does not show a signal at a g value of 1.93 by electron spin resonance. <P>COPYRIGHT: (C)2013,JPO&INPIT |
申请公布号 |
JP2013102158(A) |
申请公布日期 |
2013.05.23 |
申请号 |
JP20120231322 |
申请日期 |
2012.10.19 |
申请人 |
SEMICONDUCTOR ENERGY LAB CO LTD |
发明人 |
SASAKI TOSHINARI;NODA KOSEI;SATO YUHEI;ENDO YUTA |
分类号 |
H01L21/336;G02F1/1368;H01L21/8242;H01L21/8244;H01L21/8247;H01L27/105;H01L27/108;H01L27/11;H01L27/115;H01L29/786;H01L29/788;H01L29/792 |
主分类号 |
H01L21/336 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|