| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate connection structure for an electronic component capable of readily and securely connecting an electronic component, such as a camera module, to a connection substrate mounted on an electronic device and having a small dimension. <P>SOLUTION: An electronic component 50 includes extension portions 53, 53 each extending from lower edges of both side face thereof. An electronic-component attachment socket 51 includes a housing 3 having a component fitting portion 2 having a recessed groove shape, into which a bottom portion of the electronic component 50 is fitted on an upper face side of the electronic-component attachment socket 51. The housing 3 includes: floating protection pieces 36, 36 to engage with an upper face portion of the extension portions 53, respectively; a contact holding portion 31 which contacts with and holds a back side edge of the extension portion 53 in a socket depth direction; and an elastic anti-pulling member 20. The elastic anti-pulling member 20 protrudes so as to be able to come into and out of the component fitting portion 2, and has an elastic engaging portion 23 to restrict a movement of the extension portion 53 toward a front side in the socket depth direction. The elastic engaging portion 23 is configured to be moved by a push toward a bottom plate side, in a direction in which the elastic engaging portion 23 recedes from the component fitting portion 2. <P>COPYRIGHT: (C)2013,JPO&INPIT |
