SUBSTRATE HAVING THIN FILM OF JOINED AND METHOD OF FABRICATING THEREOF
摘要
PURPOSE: A thin film bonding substrate and a manufacturing method thereof are provided to prevent a crack due to thermal deformation mismatch by reducing the different thermal deformation of a crystal thin film and a heterogeneous substrate. CONSTITUTION: A heterogeneous substrate(140) is bonded to a crystal thin film(111). The chemical composition of the heterogeneous substrate is different from the chemical composition of the crystal thin film. A metal material layer(130) is interposed between the crystal thin film and the heterogeneous substrate and controls a thermal deformation difference between the crystal thin film and the heterogeneous substrate. The thickness of the metal material layer is 1 to 2000 um.
申请公布号
KR20130051232(A)
申请公布日期
2013.05.20
申请号
KR20110116458
申请日期
2011.11.09
申请人
SAMSUNG CORNING PRECISION MATERIALS CO., LTD.
发明人
KIM, A RA;KIM, DONG HYUN;KIM, MIN JU;SHUR, JOONG WON;JEON, JONG PIL;JUNG, KYUNG SUB;JANG, BONG HEE