发明名称 SUBSTRATE HAVING THIN FILM OF JOINED AND METHOD OF FABRICATING THEREOF
摘要 PURPOSE: A thin film bonding substrate and a manufacturing method thereof are provided to prevent a crack due to thermal deformation mismatch by reducing the different thermal deformation of a crystal thin film and a heterogeneous substrate. CONSTITUTION: A heterogeneous substrate(140) is bonded to a crystal thin film(111). The chemical composition of the heterogeneous substrate is different from the chemical composition of the crystal thin film. A metal material layer(130) is interposed between the crystal thin film and the heterogeneous substrate and controls a thermal deformation difference between the crystal thin film and the heterogeneous substrate. The thickness of the metal material layer is 1 to 2000 um.
申请公布号 KR20130051232(A) 申请公布日期 2013.05.20
申请号 KR20110116458 申请日期 2011.11.09
申请人 SAMSUNG CORNING PRECISION MATERIALS CO., LTD. 发明人 KIM, A RA;KIM, DONG HYUN;KIM, MIN JU;SHUR, JOONG WON;JEON, JONG PIL;JUNG, KYUNG SUB;JANG, BONG HEE
分类号 H01L21/20 主分类号 H01L21/20
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