| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a simple technology for an IC chip in which bump electrodes are unevenly distributed in a back face abdominal portion of an IC chip, capable of maintaining parallelism between the IC chip and a circuit board without using a spacer or a dummy electrode. <P>SOLUTION: An IC module is formed by flip-chip bonding bump electrodes 2 formed on a back face abdominal portion of an IC chip 1 with circuit conductors 4 of a film-like circuit board 5. The film-like circuit board 5 includes projections 3 formed by projecting a film on a side opposed to the bump electrodes 2. The parallelism between the IC chip 1 and the film-like circuit board 5 is maintained by the bump electrodes 2 and the projections 3. The bump electrodes 2 are substantially equal in height to the projections 3. <P>COPYRIGHT: (C)2013,JPO&INPIT |
