| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin sealing mold apparatus which allows a mold releasing film to adhere to an inner peripheral surface of a cavity part and achieves high molding accuracy even if the cavity part is deep. <P>SOLUTION: In a resin sealing mold apparatus, a substrate 16 on which electronic components 15 are mounted and a mold releasing film 14 are held by an upper mold 12 and a lower mold 20 where multiple cavity parts 23 are arranged parallel to each other on an upper surface thereof, and the electronic components 15 positioned in the cavity parts 23 are resin-sealed with a liquid resin 17 injected between the substrate 16 and the mold releasing film 14. In particular, suction grooves 24, each of which allows the cavity parts 23 of the lower mold 20 to communicate with each other, are provided and at least one suction hole is provided at each suction groove 24. <P>COPYRIGHT: (C)2013,JPO&INPIT |
