| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor light emitting device which focuses optical characteristics of a sealing material in the semiconductor light emitting device, has light distribution properties which realize a narrow radiation region where light is properly condensed, and adopts a molding method with high manufacturing efficiency, and to provide a manufacturing method of the semiconductor light emitting device. <P>SOLUTION: A semiconductor light emitting device 10 incudes: a reflector package base material 2; a semiconductor light emitting element 1 mounted in a recessed space of the reflector package base material 2; and a sealing material 3 which seals the semiconductor light emitting element 1 and contains a polar group containing acrylic resin. A light emitting surface of the sealing material 3 is recessed so as to form a curved surface and the curvature radius of the recessed light emitting surface is set to 1.8 to 4.5 times of a length of a diameter or a short side in a plane view of the light emitting surface. <P>COPYRIGHT: (C)2013,JPO&INPIT |
