发明名称 Lithographic method to apply a pattern to a substrate and lithographic apparatus
摘要 A slit shaped area of a patterning device is illuminated to impart a radiation beam with a pattern in its cross-section. A projection system projects the patterned radiation beam onto a target portion of a substrate. As the radiation beam is scanned across the target portion of the substrate, a configuration of the projection system is adjusted and applies a pattern to the target portion. The adjusting may affect a magnitude of an image magnification component of the projection system, along the length of the slit shaped area, or an image distortion in a scan direction. The adjusting is arranged to compensate an effect on pattern overlay accuracy of a distortion of the patterning device.
申请公布号 US8436977(B2) 申请公布日期 2013.05.07
申请号 US20090390552 申请日期 2009.02.23
申请人 KOK HAICO VICTOR;ASML NETHERLANDS B.V. 发明人 KOK HAICO VICTOR
分类号 G03B27/68;G03B27/52 主分类号 G03B27/68
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