| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin molding suitable for a side surface light emitting type semiconductor light emitting device which has high durability and is downsized. <P>SOLUTION: Semiconductor light emitting elements 50 are mounted on a material plate for a substrate where multiple substrates 20, each of which forms a semiconductor light emitting device 1, are integrally connected. Then, the material plate for the substrate is transfer-molded with a translucent resin 70 and is transfer-molded with a non translucent resin 80. Further, the translucent resin 70 and the non translucent resin 80 are removed so that the translucent resin 70 is partially exposed to the exterior and the material plate for the substrate is separated into the respective semiconductor light emitting devices 1. <P>COPYRIGHT: (C)2013,JPO&INPIT |
