| 摘要 |
<p>AN EPOXY RESIN COMPOSITION COMPRISING (A) AN EPOXY RESIN (B) A PHENOL RESIN, (C) A CURING ACCELERATOR, (D) SILICA, AND (E) ALUMINA AND/OR ALUMINUM HYDROXIDE, WHEREIN THE AMOUNT OF ALUMINUM TO THE TOTAL AMOUNT OF THE EPOXY RESIN COMPOSITION IS 0.25-5 WT % AND 70 WT % OR MORE OF THE SILICA HAS AN AVERAGE PARTICLE SIZE OF 25 ?M OR LESS. THE EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATING AND A SEMICONDUCTOR DEVICE COMPRISING A SEMICONDUCTOR ELEMENT ENCAPSULATED USING THE COMPOSITION POSSESS EXCELLENT CHARACTERISTICS IN RELIABILITY DURING HIGH TEMPERATURE OPERATION.</p> |
