发明名称 |
WIRING SUBSTRATE AND MANUFACTURING METHOD OF THE SAME |
摘要 |
Embodiments of the present invention provide a wiring substrate having a structure where a plurality of projection electrodes are arranged within an electrode formation region on a substrate main surface. At least one among a plurality of the projection electrodes is a variant projection electrode which has a recess portion on an upper surface, an outer diameter at the upper end that is larger than an outer diameter at the lower end, and a reverse trapezoidal cross-section shape. Embodiments of the present invention also provide methods for manufacturing wiring substrates having one or more of said variant projection electrode. |
申请公布号 |
US2013100626(A1) |
申请公布日期 |
2013.04.25 |
申请号 |
US201213659147 |
申请日期 |
2012.10.24 |
申请人 |
NGK SPARK PLUG CO., LTD.;NGK SPARK PLUG CO., LTD. |
发明人 |
INOUE MASAHIRO;SUGIMOTO ATSUHIKO |
分类号 |
H05K1/18;H05K1/02;H05K3/46 |
主分类号 |
H05K1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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