<p>PURPOSE: A semiconductor package is provided to prevent a crack of a structure on the upper side of a heat sink by preventing stress from being concentrated near the end of the heat sink. CONSTITUTION: A semiconductor chip(70) is arranged on the upper side of a substrate. A heat sink(20) is arranged on the lower side of the substrate. A heat sink covering layer(30) is arranged on the lower side of the substrate and surrounds the heat sink. The heat sink covering layer includes materials with a lower young's modulus than the young's modulus of the heat sink.</p>
